Module integration
Review any shield already fitted to the module, motherboard clearance and the additional area to be covered.
Board-level shielding components serve a range of electronic modules. Define the covered area, available space and mounting requirements before choosing a one-piece, two-piece, multi-cavity or component-based arrangement.
An application name describes the intended use; the part still needs its own dimensions and system validation. Drawings and approved samples establish the requirements for each project.
For 5G, WiFi, Bluetooth, GPS/GNSS, routers and optical modules, review coverage and mounting against the specific module layout. Boards with several modules may also need partitions and matching lids.
Mark the positions and purposes of ventilation openings, connector clearances and service access on the drawing. Validate wireless and RF performance in the actual system under the project conditions.
Review any shield already fitted to the module, motherboard clearance and the additional area to be covered.
Place compartments, grounding and connection routes around the actual board partitions.
Specify the outline, ventilation or openings, mounting and service access together.
Phones, tablets, laptops, smartwatches, TWS earbuds and camera modules often require a shield designed around limited space, component heights and assembly methods. Low-profile and miniature designs still need clearly specified critical dimensions.
Show clearances for cameras, sensors, moving parts and any required windows. The enclosure design should be validated alongside device function, imaging and wireless requirements.
For ADAS, radar, ECUs, domain controllers and power modules, provide the mounting, environmental and engineering validation requirements together. Multi-cavity or matched frame-and-lid options can be reviewed around the module partitions.
Automotive or industrial application labels are not test results for the part. Document the project requirements, inspection tasks and acceptance criteria in the drawings, sample plan and order.
| Application | Priority inputs for a quotation |
|---|---|
| Communications | Layout, coverage, connections and system validation conditions |
| Consumer electronics | Can height, component clearance, windows and assembly method |
| Automotive modules | Structure, environment, inspection and project validation requirements |
| Industrial modules | Mounting, service access and operating environment |